Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11241809 | Molding die and compression molding Method | Kazuharu Yasuda, Yuo Umei, Hideaki Ichiki | 2022-02-08 |
| 10269554 | Method for manufacturing SiC epitaxial wafer and SiC epitaxial wafer | Yuzo Sasaki | 2019-04-23 |
| 8927348 | Method of manufacturing group-III nitride semiconductor light-emitting device, and group-III nitride semiconductor light-emitting device, and lamp | Hisayuki Miki, Hironao Shinohara | 2015-01-06 |
| 8637336 | Method for producing semiconductor wafer | — | 2014-01-28 |
| 8470691 | Method for cutting substrate and method for manufacturing electronic element | Yoshiharu Saegusa | 2013-06-25 |