Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5317067 | Molding and punching out melt-mixed epoxy resin-thermoplastic resin composition with hardener | Koji Yagi | 1994-05-31 |
| 5126188 | Shaped material for use in sealing electronic parts | Toshiki Shimizu, Minoru Matsumura | 1992-06-30 |