Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11833722 | Resin molding apparatus and method of manufacturing resin molded product | Hayato Yasui, Hitoshi Okazaki | 2023-12-05 |
| 11712823 | Molding die for compression molding with resin leakage prevention member | Yusuke Yoshida | 2023-08-01 |
| 10170346 | Resin sealing apparatus and resin sealing method | Takeaki TAKA | 2019-01-01 |
| 8771563 | Manufacturing method of optical electronic components and optical electronic components manufactured using the same | Shinji Takase, Kazuki Kawakubo | 2014-07-08 |
| 8696951 | Manufacturing method of optical electronic components and optical electronic components manufactured using the same | Shinji Takase, Kazuki Kawakubo | 2014-04-15 |
| 8193558 | Optical electronic component | Shinji Takase, Kazuki Kawakubo | 2012-06-05 |
| 7985357 | Method of resin-sealing and molding an optical device | Shinji Takase, Kazuki Kawakubo | 2011-07-26 |
| 7811491 | Method for manufacturing optical electronic component | Shinji Takase, Kazuki Kawakubo | 2010-10-12 |
| 7618573 | Resin sealing method for electronic part and mold used for the method | Shinji Takase, Takashi Tamura | 2009-11-17 |
| 6929977 | Method of introducing resin for electronic component and apparatus used therefor | Shinji Takase, Takashi Tamura | 2005-08-16 |