Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6688300 | Techniques for dicing substrates during integrated circuit fabrication | — | 2004-02-10 |
| 6638791 | Techniques for maintaining alignment of cut dies during substrate dicing | — | 2003-10-28 |
| 6448156 | Techniques for maintaining alignment of cut dies during substrate dicing | — | 2002-09-10 |
| 6325059 | Techniques for dicing substrates during integrated circuit fabrication | — | 2001-12-04 |
| 6187654 | Techniques for maintaining alignment of cut dies during substrate dicing | — | 2001-02-13 |
| 6165232 | Method and apparatus for securely holding a substrate during dicing | Kiyoteru Saiki | 2000-12-26 |