AI

Akihiro Ichinose

TS Toshiba Mitsubishi-Electric Industrial Systems: 6 patents #57 of 368Top 20%
ND Ntt Docomo: 3 patents #619 of 1,706Top 40%
TM Tmeic: 1 patents #51 of 132Top 40%
Overall (All Time): #482,762 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
12318863 Ultrasonic joining apparatus 2025-06-03
11760602 Lead wire pulling out mechanism Yoshihito Yamada 2023-09-19
11433474 Ultrasonic bonding method Hiroshi Kobayashi, Yoshihito Yamada 2022-09-06
11249008 Peeling and grasping apparatus, peeling inspection apparatus, and ultrasonic vibration bonding system Yoshihito Yamada 2022-02-15
11214017 Ultrasonic vibration welding apparatus Yoshihito Yamada 2022-01-04
10953487 Ultrasonic vibration bonding apparatus Yoshihito Yamada 2021-03-23
10946475 Tool for ultrasonic bonding and apparatus for ultrasonic bonding Yoshihito Yamada 2021-03-16
7886189 Mobile terminal apparatus and diagnosis method for mobile terminal apparatus Kensaku Mori, Koichi Asano, Yoshimasa Nishimura 2011-02-08
7881700 Information communication apparatus and message displaying method Yoshimasa Nishimura, Koichi Asano, Hyunsuk Seung, Ai Nagai 2011-02-01
7849191 Download system, communication terminal, server, and download method Yasuhiro Nose, Koichi Moriyama, Seiji Hoshi, Masato Takeichi, Kazunori Nasu +2 more 2010-12-07