Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8168744 | Polyimide film for molding, its manufacturing method and molding product | — | 2012-05-01 |
| 5567749 | Semiconductor device-encapsulating epoxy resin composition | Yasushi Sawamura, Masayuki Tanaka | 1996-10-22 |
| 5360837 | Semiconductor device-encapsulating epoxy resin composition | Shiro Honda, Yasushi Sawamura, Masayuki Tanaka, Keiji Kayaba | 1994-11-01 |