Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6982484 | Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet | Mikihiro Ogura, Masami Tokunaga, Yasuaki Tsutsumi, Ryuichi Kamei, Ken Shimizu | 2006-01-03 |