HW

Hiromitsu Wada

TC Toray Engineering Co.: 2 patents #27 of 169Top 20%
IBM: 1 patents #44,794 of 70,183Top 65%
Overall (All Time): #1,986,447 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9711483 Bonding apparatus 2017-07-18
6515498 Apparatus and method for pressing prober Shigetaka Kobayashi, Toshiyuki Eba, Takanori Tahara, Kenji Sato 2003-02-04