Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659801 | High efficiency buffer stocker | Kuo-Lei Ma, Chih-Hung Huang, Min-Yu Hsieh, Fiona Lee | 2017-05-23 |
| 9125335 | Ceramic circuit board and method of making the same | — | 2015-09-01 |
| 8898892 | Method of making circuit board module | Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu | 2014-12-02 |
| 8549739 | Method of making circuit board module | Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu | 2013-10-08 |
| 8461614 | Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device | Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu | 2013-06-11 |
| 8431835 | Packaging device for an electronic element and method for making the same | Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu | 2013-04-30 |
| 8308418 | High efficiency buffer stocker | Veen Ma, Chih-Hung Huang, Goldie Hsieh, Fiona Lee | 2012-11-13 |