SM

Seika Matidori

TO Toshiba: 2 patents #606 of 2,688Top 25%
Overall (All Time): #2,337,590 of 4,157,543Top 60%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
4755235 Electrically conductive precipitation hardened copper alloy and a method for manufacturing the same Masato Sakai 1988-07-05
4451430 Method of producing copper alloy by melting technique Koichi Teshima, Masato Sakai 1984-05-29