Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11161196 | Metallic member bonding device for pressing rod-shaped or cylindrical first metallic member into hole portion of annular second metallic member to bond the same and bonding method therefor | Akira Hashimoto | 2021-11-02 |
| 8356397 | Manufacturing method of clutch for automatic transmission and automatic transmission | Hideo Toyota, Naohiro Sakaue, Katsutoshi Mukai, Koichi Matsuura, Shinichiro Tenma +2 more | 2013-01-22 |
| 7926478 | Super abrasive grain wire saw winding structure, super abrasive grain wire saw cutting device, and super abrasive grain wire saw winding method | Masaaki Yamanaka, Yoshizumi Ishitobi | 2011-04-19 |
| 4680331 | Aqueous coating composition of fluorocarbon resin | Takeshi Suzuki, Shigetake Tominaga | 1987-07-14 |
| 4489247 | Integrated injection logic circuit with test pads on injector common line | Masashi Ikeda, Yukuya Tokumaru, Masaki Ota | 1984-12-18 |
| 4470061 | Integrated injection logic | — | 1984-09-04 |
| 4464589 | IL Buffer having higher breakdown levels | Toshinori Moriyasu | 1984-08-07 |
| 4459606 | Integrated injection logic semiconductor devices | Yukuya Tokumaru, Satoshi Shinozaki, Junichi Nakamura, Shintaro Ito, Yoshio Nishi | 1984-07-10 |
| 4260906 | Semiconductor device and logic circuit constituted by the semiconductor device | Yukuya Tokumaru | 1981-04-07 |