Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8173037 | Wafer polish monitoring method and device | Takashi Fujita, Toshiyuki Yokoyama | 2012-05-08 |
| 7830141 | Film thickness measuring apparatus and film thickness measuring method | Takashi Fujita, Toshiyuki Yokoyama | 2010-11-09 |
| 7821257 | Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thickness | Takashi Fujita, Toshiyuki Yokoyama | 2010-10-26 |
| 7795865 | Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof | Takashi Fujita, Toshiyuki Yokoyama | 2010-09-14 |