HI

Hotaka Ikeda

TC Tokyo Seimitsu Co.: 1 patents #110 of 257Top 45%
Overall (All Time): #3,738,781 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5501104 Method of measuring the depth of full-cut dicing grooves by using an ultrasonic detector and a dicing apparatus for carrying out the same Masaharu Nakamura 1996-03-26