Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7565002 | Wafer surface observation apparatus | Hiroyuki Yasutomi, Mikio Sakuma | 2009-07-21 |
| RE39018 | High speed method of aligning cutting lines of a workplace using patterns | Masayuki Azuma, Mani Fischer | 2006-03-21 |
| 6354912 | Workpiece cutting method for use with dicing machine | Masateru Osada, Masayuki Azuma, Felix Cohen | 2002-03-12 |
| 6142138 | High speed method of aligning cutting lines of a workpiece using patterns | Masayuki Azuma | 2000-11-07 |
| 5885051 | Workpiece transfer equipment in dicing machine | Masayuki Azuma | 1999-03-23 |