HC

Hiroki Chisaka

TC Tokyo Ohka Kogyo Co.: 31 patents #29 of 684Top 5%
DA Daicel: 2 patents #168 of 523Top 35%
EN Eneos: 2 patents #54 of 206Top 30%
Overall (All Time): #116,448 of 4,157,543Top 3%
31
Patents All Time

Issued Patents All Time

Showing 26–31 of 31 patents

Patent #TitleCo-InventorsDate
9890250 Method for producing polybenzoxazole resin Kunihiro Noda, Dai Shiota, Masaru Shida 2018-02-13
9891527 Developing solution and development processing method of photosensitive resin composition Kunihiro Noda, Dai Shiota 2018-02-13
9683150 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material Yoshinori Tadokoro, Kunihiro Noda, Dai Shiota 2017-06-20
9547239 Positive photosensitive resin composition, method for forming polyimide resin patterns, and patterned polyimide resin film Kunihiro Noda, Dai Shiota 2017-01-17
9529258 Energy-sensitive resin composition Kunihiro Noda, Dai Shiota, Kazuya Someya 2016-12-27
9458355 Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solution Kunihiro Noda, Dai Shiota, Kazuya Someya 2016-10-04