Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
JZ

Jon Zuo — 16 Patents

THThermal: 11 patents #4 of 92Top 5%
ATAdvanced Cooling Technologies: 3 patents #12 of 48Top 25%
Lancaster, PA: #52 of 963 inventorsTop 6%
Pennsylvania: #4,567 of 74,527 inventorsTop 7%
Overall (All Time): #284,196 of 4,157,543Top 7%
16 Patents All Time
Jon Zuo has been granted 16 US patents while listed as an inventor at Thermal. The first was granted in 2002 and the most recent in November 2021. Jon Zuo ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Jon Zuo in Lancaster, PA, US.

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
11184996 Double sided heat exchanger cooling unit Scott Garner, Peter Dussinger, Daniel Reist 2021-11-23
10638639 Double sided heat exchanger cooling unit Scott Garner, Peter Dussinger, Daniel Reist 2020-04-28
7306028 Modular heat sink Ernest H. Dubble, Donald M. Ernst 2007-12-11
7005738 Semiconductor package with lid heat spreader Donald M. Ernst 2006-02-28
6990816 Hybrid capillary cooling apparatus David Bruce Sarraf 2006-01-31
6948556 Hybrid loop cooling of high powered devices William G. Anderson, G. Yale Eastman, David Bruce Sarraf 2005-09-27
6889755 Heat pipe having a wick structure containing phase change materials Donald M. Ernst 2005-05-10
6858929 Semiconductor package with lid heat spreader Donald M. Ernst 2005-02-22
6631077 Heat spreader with oscillating flow 2003-10-07
6579747 Method of making electronics package with specific areas having low coefficient of thermal expansion 2003-06-17
6566743 Electronics package with specific areas having low coefficient of thermal expansion 2003-05-20
6536510 Thermal bus for cabinets housing high power electronics equipment Dmitry Khrustalev 2003-03-25
6525420 Semiconductor package with lid heat spreader Donald M. Ernst 2003-02-25
6437437 Semiconductor package with internal heat spreader Scott Garner 2002-08-20
6408941 Folded fin plate heat-exchanger 2002-06-25
6388882 Integrated thermal architecture for thermal management of high power electronics L. Ronald Hoover, A. L. Phillips 2002-05-14