Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10660217 | Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling | Jun Yang, Tengyuan Zhang | 2020-05-19 |
| 10472448 | Surface-modification of printed objects | Jun Yang, Xiaolong Wang, Xiaobing Cai | 2019-11-12 |