Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10631413 | Enhanced protective layering process to accommodate circuit board heat dissipation | Carl Foehner | 2020-04-21 |
| 9900988 | Protective layering process for circuit board EMI sheilding and thermal management | John Dispenza, Mario DeAngelis | 2018-02-20 |
| 9860992 | Protective layering process for circuit boards | John Dispenza, Mario DeAngelis | 2018-01-02 |
| 9254588 | Protective layering process for circuit boards | John Dispenza, Mario DeAngelis | 2016-02-09 |