Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11519881 | Method for the evaluation of adhesive bond strength via swept-frequency ultrasonic phase measurements | Harold A. Haldren, Daniel F. Perey, William T. Yost, Mool C. Gupta | 2022-12-06 |
| 11373264 | Method and means to analyze thermographic data acquired during automated fiber placement | Peter D. Juarez, Elizabeth D. Gregory | 2022-06-28 |
| 10872391 | Method and means to analyze thermographic data acquired during automated fiber placement | Peter D. Juarez, Elizabeth D. Gregory | 2020-12-22 |
| 8490463 | Assessment and calibration of a crimp tool equipped with ultrasonic analysis features | William T. Yost, Daniel F. Perey | 2013-07-23 |
| 7181942 | Device and method for connections made between a crimp connector and wire | William T. Yost, Daniel F. Perey | 2007-02-27 |
| 7060991 | Method and apparatus for the portable identification of material thickness and defects along uneven surfaces using spatially controlled heat application | Thomas L. Reilly, A. Ronald Jacobstein | 2006-06-13 |
| 6985083 | Marking electrical wiring with condition indicators | William T. Yost, Daniel F. Perey | 2006-01-10 |
| 6838995 | Method for anticipating problems with electrical wiring | William T. Yost, Daniel F. Perey | 2005-01-04 |
| 6000844 | Method and apparatus for the portable identification of material thickness and defects using spatially controlled heat application | William P. Winfree | 1999-12-14 |
| 5562345 | Method and apparatus for thermographically and quantitatively analyzing a structure for disbonds and/or inclusions | Joseph S. Heyman, William P. Winfree, Joseph N. Zalamedia | 1996-10-08 |