Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8163094 | Method to improve indium bump bonding via indium oxide removal using a multi-step plasma process | Todd J. Jones, Richard Vasquez, Michael E. Hoenk, Matthew R. Dickie, Shouleh Nikzad | 2012-04-24 |