DS

Diane M. Stoakley

NASA: 11 patents #69 of 3,881Top 2%
NA National Institute Of Aerospace Associates: 2 patents #14 of 36Top 40%
📍 Poquoson, VA: #8 of 97 inventorsTop 9%
🗺 Virginia: #1,721 of 34,511 inventorsTop 5%
Overall (All Time): #299,967 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
8529825 Fabrication of nanovoid-imbedded bismuth telluride with low dimensional system Sang-Hyon Chu, Sang H. Choi, Jae-Woo Kim, Yeonjoon Park, James R. Elliott +1 more 2013-09-10
8083986 Fabrication of advanced thermoelectric materials by hierarchical nanovoid generation Sang H. Choi, Yeonjoon Park, Sang-Hyon Chu, James R. Elliott, Glen C. King +2 more 2011-12-27
7758927 Laser-induced fabrication of metallic interlayers and patterns in polyimide films Gilda Miner, Gregory Gaddy, Brent D. Koplitz, Steven M. Simpson, Michael F. Lynch +1 more 2010-07-20
7514726 Graded index silicon geranium on lattice matched silicon geranium semiconductor alloy Yeonjoon Park, Sang H. Choi, Glen C. King, James R. Elliott 2009-04-07
6372877 Poly(aryl ether ketones) bearing alkylated side chains Patrick E. Cassidy, John W. Fitch, III, Scott D. Gronewald, Anne K. St. Clair 2002-04-16
6019926 Reflective silvered polyimide films via in situ thermal reduction silver (I) complexes Robin E. Southward, David W. Thompson, Anne K. St. Clair 2000-02-01
5575955 Electrically conductive polyimide film containing gold (III) ions, composition, and process of making Maggie L. Caplan, Anne K. St. Clair 1996-11-19
5520960 Electrically conductive polyimides containing silver trifluoroacetylacetonate James D. Rancourt, Maggie L. Caplan, Anne K. St. Clair, Larry T. Taylor 1996-05-28
5376209 Process for preparing an assembly of an article and a polymide which resists dimensional change, delamination and debonding when exposed to changes in temperature Anne K. St. Clair 1994-12-27
5272248 Polyimide processing additives J. Richard Pratt, Terry L. St. Clair, Harold D. Burks 1993-12-21
5248519 Process for preparing an assembly of an article and a soluble polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature Anne K. St. Clair 1993-09-28
5116939 Polyimide processing additives James C. Administrator of the National Aeronautics and Space Fletcher, J. Richard Pratt, Terry L. St. Clair, Harold D. Burks 1992-05-26
4895972 Process for lowering the dielectric constant of polyimides using diamic acid additives Anne K. St. Clair 1990-01-23
4864865 Tensile film clamps and mounting block for the rheovibron and autovibron viscoelastometer Anne K. St. Clair, Bruce D. Little 1989-09-12
4510277 Process for improving moisture resistance of epoxy resins by addition of chromium ions Anne K. St. Clair, Terry L. St. Clair, Jag J. Singh 1985-04-09
4473674 Process for improving mechanical properties of epoxy resins by addition of cobalt ions Anne K. St. Clair 1984-09-25