Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11912900 | Step-wise fabrication of conductive carbon nanotube bridges via dielectrophoresis | Tuo Zhou | 2024-02-27 |
| 11840769 | Guided template based electrokinetic microassembly (TEA) | Tuo Zhou | 2023-12-12 |
| 11534832 | Selective laser sintering using functional inclusions dispersed in the matrix material being created | Edward Tackett, Benjamin Dolan | 2022-12-27 |
| 11142738 | Sieve system and methods for cell media exchange | — | 2021-10-12 |
| 11001002 | Powder bed additive manufacturing method of fabricating a porous matrix | — | 2021-05-11 |
| 10799952 | Selective laser sintering using functional inclusions dispersed in the matrix material being created | Edward Tackett, Benjamin Dolan | 2020-10-13 |
| 10245614 | Imprinter for conformal coating of three-dimensional surfaces | Arash Kheradvar | 2019-04-02 |
| 10166541 | Centrifugal microfluidic platform for automated media exchange | Ling Kong | 2019-01-01 |
| 9353455 | Dielectrophoresis and electrodeposition process for selective particle entrapment | Victor H. Perez-Gonzalez, Vinh Ho | 2016-05-31 |
| 8641883 | Polymer-based high surface area multi-layered three-dimensional structures and method of making same | Marc J. Madou | 2014-02-04 |
| 7525178 | Semiconductor device with capacitively coupled field plate | — | 2009-04-28 |
| 6768211 | Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging | — | 2004-07-27 |
| 6621166 | Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging | — | 2003-09-16 |