YL

Yu-Sun Lee

TM The Mead: 3 patents #131 of 526Top 25%
BG B. F. Goodrich: 1 patents #389 of 734Top 55%
Samsung: 1 patents #49,284 of 75,807Top 70%
📍 Seoul, OH: #21 of 26 inventorsTop 85%
Overall (All Time): #990,943 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
9589899 Semiconductor device having a gate cutting region and a cross-coupling pattern between gate structures Hwi-Chan Jun, Dae-Hee Weon, Heon-Jong Shin 2017-03-07
4230495 Process for producing a pressure-sensitive carbonless copy sheet using microcapsules formed in situ in a radiation curable binder Dale R. Shackle 1980-10-28
4214061 Pressure-sensitive adhesive 1980-07-22
4200667 Process for producing a pressure-sensitive carbonless copy sheet using microcapsules formed in situ in a radiation curable binder Dale R. Shackle 1980-04-29
4191404 Process for producing a pressure-sensitive carbonless copy sheet using microcapsules formed in situ in a radiation curable binder Dale R. Shackle 1980-03-04