Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12208471 | Solder materials including supercooled micro-capsules and alloyed particles | Martin Thuo, Ian Tevis | 2025-01-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12208471 | Solder materials including supercooled micro-capsules and alloyed particles | Martin Thuo, Ian Tevis | 2025-01-28 |