Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5232970 | Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications | Jitka Solc | 1993-08-03 |
| 5108824 | Rubber modified epoxy resins | Chun-Shan Wang | 1992-04-28 |