Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8272618 | Minimum bond thickness assembly feature assurance | Jeffrey J. Kilwin | 2012-09-25 |
| 8060835 | Three dimensional defect mapping | Robert Martin Trn, John R. Dworschak, Michael Timothy Rusert | 2011-11-15 |
| 7555873 | Self-locating feature for a pi-joint assembly | Jeffrey J. Kilwin, Philip L. Freeman | 2009-07-07 |