Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11581446 | Semiconductor device including an electrically conductive adhesive layer and a bypass diode in a carrier | Eric M. Rehder, Xiaobo ZHANG, Joseph C. Boisvert | 2023-02-14 | $66,835,000 |