Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6510240 | Automatic detection of die absence on the wire bonding machine | Sreenivasan K. Koduri, David Ho | 2003-01-21 |
| 5981370 | Method for maximizing interconnection integrity and reliability between integrated circuits and external connections | Reynaldo Rincon | 1999-11-09 |