Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125811 | Semiconductor structure and method for wafer scale chip package | Indumini Ranmuthu, Manoj Kumar Jain | 2024-10-22 |
| 5825194 | Large integrated circuit with modulator probe structures | Rohit L. Bhuva, Bao G. Tran, James L. Conner, Michael J. Overlaur | 1998-10-20 |
| 5648730 | Large integrated circuit with modular probe structures | Rohit L. Bhuva, Bao G. Tran, James L. Conner, Michael J. Overlaur | 1997-07-15 |