Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6230399 | Backside encapsulation of tape automated bonding device | Abhay Maheshwari | 2001-05-15 |
| 6228680 | Low stress method and apparatus for underfilling flip-chip electronic devices | — | 2001-05-08 |
| 6213347 | Low stress method and apparatus of underfilling flip-chip electronic devices | — | 2001-04-10 |
| 6097099 | Electro-thermal nested die-attach design | Prosenjit Ghosh | 2000-08-01 |
| 6090641 | Electro-thermal nested die-attach design | Prosenjit Ghosh | 2000-07-18 |
| 5834336 | Backside encapsulation of tape automated bonding device | Abhay Maheshwari | 1998-11-10 |
| 5811317 | Process for reflow bonding a semiconductor die to a substrate and the product produced by the product | Abhay Maheshwari, Chris Thornton | 1998-09-22 |
| 5745985 | Method of attaching a semiconductor microchip to a circuit board | Prosenjit Ghosh | 1998-05-05 |