Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10564216 | Multiple rate signature test to verify integrated circuit identity | Gunvant Patel | 2020-02-18 |
| 10018668 | Kill die subroutine at probe for reducing parametric failing devices at package test | Hoi Hin Loo | 2018-07-10 |
| 9772372 | Kill die subroutine at probe for reducing parametric failing devices at package test | Hoi Hin Loo | 2017-09-26 |
| 9664736 | Multiple rate signature test to verify integrated circuit identity | Gunvant Patel | 2017-05-30 |