Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600557 | Packaged device having selective lead pullback for dimple depth control | — | 2023-03-07 |
| 7038311 | Thermally enhanced semiconductor package | Joe D. Woodall | 2006-05-02 |