Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7741701 | Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment | Peter Sakakini | 2010-06-22 |
| 7078271 | Leadframe-to-plastic lock for IC package | — | 2006-07-18 |
| 7041578 | Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment including the backside | Peter Sakakini | 2006-05-09 |
| 6794738 | Leadframe-to-plastic lock for IC package | — | 2004-09-21 |
| 6534337 | Lead frame type plastic ball grid array package with pre-assembled ball type contacts | John W. Orcutt, Randall V. Tekavec | 2003-03-18 |
| 5558267 | Moat for die pad cavity in bond station heater block | Henry L. Humphrey, Randall V. Tekavec | 1996-09-24 |