Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176255 | Cantilevered dies in ceramic packages | Paul Merle Emerson, Mohammad Hadi Motieian Najar | 2024-12-24 |
| 11915986 | Ceramic semiconductor device package with copper tungsten conductive layers | Hector Torres | 2024-02-27 |
| 8860218 | Semiconductor device having improved contact structure | — | 2014-10-14 |
| 8704371 | Semiconductor device having multiple bump heights and multiple bump diameters | — | 2014-04-22 |
| 8385023 | Printed circuit cable assembly for a hard disk drive | — | 2013-02-26 |