Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903345 | Power MOSFET with metal filled deep sinker contact for CSP | Yufei Xiong, Yunlong Liu, Hong-Seon Yang, Ho Lin, Tianping Lv +1 more | 2021-01-26 |
| 9030023 | Bond pad stack for transistors | Jing Wang, Lin Lin, Qi Yang, Jianxin Liu | 2015-05-12 |
| 8815730 | Method for forming bond pad stack for transistors | Jing Wang, Lin Lin, Qi Yang, Jianxin Liu | 2014-08-26 |