Issued Patents All Time
Showing 26–50 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653388 | Integrating multi-output power converters having vertically stacked semiconductor chips | Marie Denison, Brian Ashley Carpenter, Juan Alejandro Herbsommer, Jonathan Almeria Noquil | 2017-05-16 |
| 9640519 | Photo-sensitive silicon package embedding self-powered electronic system | Walter Hans Paul Schroen, Jonathan Almeria Noquil, Thomas E. Grebs, Simon John Molloy | 2017-05-02 |
| 9553068 | Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer | Jonathan Almeria Noquil, Juan Alejandro Herbsommer | 2017-01-24 |
| 9543240 | DC-DC converter having terminals of semiconductor chips directly attachable to circuit board | Jonathan Almeria Noquil | 2017-01-10 |
| 9508633 | High performance power transistor having ultra-thin package | Juan Alejandro Herbsommer, Jonathan Almeria Noquil | 2016-11-29 |
| 9425132 | Stacked synchronous buck converter having chip embedded in outside recess of leadframe | Jonathan Almeria Noquil | 2016-08-23 |
| 9373571 | Integrating multi-output power converters having vertically stacked semiconductor chips | Marie Denison, Brian Ashley Carpenter, Juan Alejandro Herbsommer, Jonathan Almeria Noquil | 2016-06-21 |
| 9355991 | Integrating multi-output devices having vertically stacked semiconductor chips | Marie Denison, Brian Ashley Carpenter, Juan Alejandro Herbsommer, Jonathan Almeria Noquil | 2016-05-31 |
| 9305852 | Silicon package for embedded electronic system having stacked semiconductor chips | Jonathan Almeria Noquil, Thomas E. Grebs, Simon John Molloy | 2016-04-05 |
| 9305872 | DC-DC converter having terminals of semiconductor chips directly attachable to circuit board | Jonathan Almeria Noquil | 2016-04-05 |
| 9214415 | Integrating multi-output power converters having vertically stacked semiconductor chips | Marie Denison, Brian Ashley Carpenter, Juan Alejandro Herbsommer, Jonathan Almeria Noquil | 2015-12-15 |
| 9184121 | Stacked synchronous buck converter having chip embedded in outside recess of leadframe | Johathan A. Noquil | 2015-11-10 |
| 9171828 | DC-DC converter having terminals of semiconductor chips directly attachable to circuit board | Jonathan Almeria Noquil | 2015-10-27 |
| 9165865 | Ultra-thin power transistor and synchronous buck converter having customized footprint | Juan Alejandro Herbsommer, Jonathan Almeria Noquil | 2015-10-20 |
| 9076891 | Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer | Jonathan Almeria Noquil, Juan Alejandro Herbsommer | 2015-07-07 |
| 8910369 | Fabricating a power supply converter with load inductor structured as heat sink | Juan Alejandro Herbsommer, Jonathan Almeria Noquil, David Jauregui, Lucian Hriscu | 2014-12-16 |
| 8760872 | DC-DC converter vertically integrated with load inductor structured as heat sink | Juan Alejandro Herbsommer, Jonathan Almeria Noquil, David Jauregui, Lucian Hriscu | 2014-06-24 |
| 8581660 | Power transistor partial current sensing for high precision applications | Marie Denison, Ubol Udompanyavit, Joseph Maurice Khayat | 2013-11-12 |
| 8546925 | Synchronous buck converter having coplanar array of contact bumps of equal volume | Juan Alejandro Herbsommer, Jonathan Almeria Noquil, David Jauregui, Mark E. Granahan | 2013-10-01 |
| 8455361 | Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device | Juan Alejandro Herbsommer | 2013-06-04 |
| 8431979 | Power converter having integrated capacitor | Juan Alejandro Herbsommer, Jonathan Almeria Noquil, David Jauregui | 2013-04-30 |
| 8389336 | Semiconductor device package and method of assembly thereof | Juan Alejandro Herbsommer, Jonathan Almeria Noquil | 2013-03-05 |
| 8354303 | Thermally enhanced low parasitic power semiconductor package | Jonathan Almeria Noquil, Juan Alejandro Herbsommer | 2013-01-15 |
| 8304903 | Wirebond-less semiconductor package | Juan Alejandro Herbsommer, George John Przybylek | 2012-11-06 |
| 8049312 | Semiconductor device package and method of assembly thereof | Juan Alejandro Herbsommer, Jonathan Almeria Noquil | 2011-11-01 |