Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6384486 | Bonding over integrated circuits | Samuel A. Ciani | 2002-05-07 |
| 5939777 | High aspect ratio integrated circuit chip and method for producing the same | — | 1999-08-17 |
| 5837558 | Integrated circuit chip packaging method | Mary E. Helmick | 1998-11-17 |
| 5664497 | Laser symbolization on copper heat slugs | Archie W. Sutton, Ray H. Purdom | 1997-09-09 |