Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6188138 | Bumps in grooves for elastic positioning | Hjalmar Hesselbom | 2001-02-13 |
| 6091027 | Via structure | Hjalmar Hesselbom | 2000-07-18 |
| 6068801 | Method for making elastic bumps from a wafer mold having grooves | Hjalmar Hesselbom | 2000-05-30 |
| 6042391 | High density electrical connectors | Hjalmar Hesselbom | 2000-03-28 |
| 5998875 | Flip-chip type connection with elastic contacts | Hjalmar Hesselbom, Hans Hentzell | 1999-12-07 |