LK

Lance R. Kaufman

TI Teledyne Industries: 1 patents #209 of 517Top 45%
📍 Mequon, WI: #11 of 452 inventorsTop 3%
🗺 Wisconsin: #765 of 40,088 inventorsTop 2%
Overall (All Time): #99,518 of 4,157,543Top 3%
35
Patents All Time

Issued Patents All Time

Showing 1–25 of 35 patents

Patent #TitleCo-InventorsDate
6118660 Circuit module with improved heat transfer 2000-09-12
5070602 Method of making a circuit assembly John A. Dombeck 1991-12-10
5032691 Electric circuit assembly with voltage isolation 1991-07-16
4990720 Circuit assembly and method with direct bonded terminal pin 1991-02-05
4945445 Current sense circuit Richard F. Schmerda, John A. Dombeck 1990-07-31
4924292 Direct bond circuit assembly with crimped lead frame 1990-05-08
4907124 Bolted circuit assembly with isolating washer 1990-03-06
4902854 Hermetic direct bond circuit assembly 1990-02-20
4879633 Direct bond circuit assembly with ground plane 1989-11-07
4860164 Heat sink apparatus with electrically insulative intermediate conduit portion for coolant flow 1989-08-22
4831723 Direct bond circuit assembly with crimped lead frame 1989-05-23
4818895 Direct current sense lead 1989-04-04
4819042 Isolated package for multiple semiconductor power components 1989-04-04
4788765 Method of making circuit assembly with hardened direct bond lead frame John A. Dombeck, Herbert O. Frederickson 1988-12-06
4739449 Circuit package with thermal expansion relief chimney 1988-04-19
4724514 Low cost compressively clamped circuit and heat sink assembly 1988-02-09
4713723 Isolation transformer 1987-12-15
4700273 Circuit assembly with semiconductor expansion matched thermal path 1987-10-13
4630174 Circuit package with external circuit board and connection 1986-12-16
4577387 Method of mounting a compact circuit package to a heat sink or the like 1986-03-25
4574162 Compact circuit package with improved construction for clamping to enhance heat transfer 1986-03-04
4554613 Multiple substrate circuit package 1985-11-19
4546410 Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink 1985-10-08
4546411 Mounting of a compact circuit package to a heat sink or the like 1985-10-08
4498120 Electrical sub-assembly having a lead frame to be compressed between a circuit board and heat sink 1985-02-05