Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5712528 | Dual substrate full color TFEL panel with insulator bridge structure | William A. Barrow, Eric R. Dickey | 1998-01-27 |
| 5118987 | Multi-layer structure and method of constructing the same for providing TFEL edge emitter modules | David Leksell, Zoltan K. Kun, Juris A. Asars, William A. Barrow | 1992-06-02 |
| 4657322 | Microwave interconnect | H. Erwin Grellmann, Keith E. Jones, John A. Wright | 1987-04-14 |
| 4650545 | Polyimide embedded conductor process | John J. Reagan, Robert Lee Beckman | 1987-03-17 |
| 4600907 | Coplanar microstrap waveguide interconnector and method of interconnection | H. Erwin Grellman, John J. Reagan, Leonard A. Roland | 1986-07-15 |