Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11987033 | System and method of dielectric bonding | Hugh Foran, Joshua Dech | 2024-05-21 |
| 11007674 | Method for manufacturing heated molding material and device for heating molding material | Yohei Shinfuku, Guofei Hua | 2021-05-18 |