TM

Toshinobu Miyagoshi

Tdk: 10 patents #621 of 3,796Top 20%
NM Nippon Mektron: 1 patents #123 of 286Top 45%
Overall (All Time): #439,375 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12406866 Stamp tool, transfer device, and element array manufacturing method Seijiro SUNAGA, Makoto Yamashita, Yasuo Kato, Tatsunori Otomo, Mitsuyoshi Makida +1 more 2025-09-02
11541477 Ultrasonic bonding device and ultrasonic bonding method Seijiro SUNAGA, Mitsuyoshi Makida 2023-01-03
11267071 Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic bonding method Seijiro SUNAGA, Tatsunori Otomo 2022-03-08
11167541 Apparatus for manufacturing element array and apparatus for removing specific element Seijiro SUNAGA, Osamu Shindo, Yasuo Kato 2021-11-09
11101317 Method of manufacturing element array and method of removing specific element Seijiro SUNAGA, Osamu Shindo, Yasuo Kato 2021-08-24
10162137 Apparatus and method for mounting photoelectric element Toru Mizuno, Hiroshi Ikeda, Tatsunori Otomo, Shoji Takano, Fumihiko Matsuda +1 more 2018-12-25
7828190 Ultrasonic mounting apparatus Yuji Saito, Tomomi Asakura, Mitsuyoshi Makida, Toru Mizuno 2010-11-09
7814645 Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration Toru Mizuno, Tomomi Asakura, Yuji Saito, Hiroyuki Takano 2010-10-19
7508115 Horn, horn unit, and bonding apparatus using same Norihiko Kawada, Yuji Saito, Masakazu Nakayama, Toru Mizuno, Junichi Kamata 2009-03-24
7181833 Method of mounting an electronic part Toru Mizuno, Tomomi Asakura, Masatoshi Ito, Masaaki Kaneko 2007-02-27
6931717 Apparatus for mounting an electronic part onto a circuit substrate Toru Mizuno, Tomomi Asakura, Masatoshi Ito, Masaaki Kaneko 2005-08-23