Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11546989 | Multilayer board insulating sheet, multilayer board, and method of manufacturing multilayer board | Seiko KOMATSU, Seiichi Tajima | 2023-01-03 |
| 11445605 | Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board | Seiko KOMATSU, Seiichi Tajima, Wakiko SATO | 2022-09-13 |
| 11412621 | Device-embedded board and method of manufacturing the same | Seiichi Tajima, Takashi Kariya | 2022-08-09 |
| 11382218 | Printed wiring board and method for manufacturing the same | Seiichi Tajima, Takashi Kariya | 2022-07-05 |
| 11335614 | Electric component embedded structure | Kenichi Yoshida, Mitsuhiro Tomikawa | 2022-05-17 |
| 11114810 | Laser device | Koichi Iyama, Yasuki TAKEUCHI, Yuma HATANO, Takuto IGUCHI, Yoshinori Kato +1 more | 2021-09-07 |
| 10905013 | Printed wiring board and method for manufacturing the same | Seiichi Tajima, Takashi Kariya | 2021-01-26 |
| 10374377 | Laser medium, laser medium unit, and laser beam amplification device | Takashi Sekine, Yoshinori Kato, Yoshinori TAMAOKI, Takashi Kurita, Toshiyuki Kawashima | 2019-08-06 |
| 10063026 | Laser beam amplification device | Takashi Sekine, Yoshinori Kato, Yoshinori TAMAOKI, Takashi Kurita, Toshiyuki Kawashima | 2018-08-28 |
| 8544167 | Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate | — | 2013-10-01 |
| 8530752 | Multilayer circuit board and method for manufacturing the same | Kenichi Kawabata | 2013-09-10 |
| 8237059 | Electronic component-embedded board and method of manufacturing the same | Yoshikazu Kanemaru, Kenichi Kawabata | 2012-08-07 |
| 8188375 | Multilayer circuit board and method for manufacturing the same | Kenichi Kawabata | 2012-05-29 |
| 8026614 | Semiconductor IC-embedded substrate and method for manufacturing same | Kenichi Kawabata | 2011-09-27 |
| 8005356 | Video transmission system of a ring network | Kazunori Nakamura | 2011-08-23 |
| 7906370 | Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate | — | 2011-03-15 |
| 7544537 | Semiconductor IC-embedded substrate and method for manufacturing same | Kenichi Kawabata | 2009-06-09 |
| 7247590 | Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring board | Kenichi Kawabata | 2007-07-24 |