Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6749183 | Production method of electronic parts and water treatment apparatus | Masashi Gotoh, Jitsuo Kanazawa | 2004-06-15 |
| 6730858 | Circuit board having bonding areas to be joined with bumps by ultrasonic bonding | Masashi Gotoh, Jitsuo Kanazawa, Kenji Honda | 2004-05-04 |
| 6471783 | Production method of electronic parts and water treatment apparatus | Masashi Gotoh, Jitsuo Kanazawa | 2002-10-29 |
| 6320739 | Electronic part and manufacturing method therefor | Masashi Gotoh, Jitsuo Kanazawa | 2001-11-20 |
| 6282781 | Resin package fabrication process | Masashi Gotoh, Jitsuo Kanazawa | 2001-09-04 |
| 6263565 | Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same | Masashi Gotoh, Jitsuo Kanazawa, Kenji Honda | 2001-07-24 |
| 6204454 | Wiring board and process for the production thereof | Masashi Gotoh, Jitsuo Kanazawa | 2001-03-20 |