Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7765678 | Method of bonding metal ball for magnetic head assembly | Takao Haino | 2010-08-03 |
| 7649715 | Magnetic head assembly bonding electrode pad of slider and electrode pad of flexible wiring substrate together by solder | Takao Haino, Hideaki Abe | 2010-01-19 |
| 6477016 | Junction assembly of bonding pad and bump, and magnetic head device using the same | Koichi Naito | 2002-11-05 |