Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11414554 | Conductive coating material and production method for shielded package using conductive coating material | Hiroaki Umeda, Kazuhiro Matsuda | 2022-08-16 |
| 11370926 | Conductive coating material and production method for shielded package using conductive coating material | Hiroaki Umeda, Kazuhiro Matsuda | 2022-06-28 |
| 11236227 | Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same | Hiroaki Umeda, Kazuhiro Matsuda | 2022-02-01 |
| 10893603 | Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same | Hiroaki Umeda, Kazuhiro Matsuda | 2021-01-12 |
| 9420706 | Multilayer wiring board | Norihiro Yamaguchi, Hiroaki Umeda | 2016-08-16 |
| 8756805 | Method of manufacturing multilayer printed wiring board | Norihiro Yamaguchi, Hiroaki Umeda | 2014-06-24 |