YM

Yuichi Makita

TK Tanaka Kikinzoku Kogyo K.K.: 10 patents #28 of 436Top 7%
📍 Tsukuba, JP: #371 of 2,818 inventorsTop 15%
Overall (All Time): #486,755 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
12163034 Silver ink for low-temperature calcination Yuusuke Ohshima, Hiroki Sato, Noriaki Nakamura, Kenjiro Koshiji, Masato Kasuga +1 more 2024-12-10
12035470 Electroconductive substrate having metal wiring, method for producing the electroconductive substrate, and metal ink for forming metal wiring Kenjiro Koshiji, Noriaki Nakamura, Masato Kasuga, Yuusuke Ohshima, Hiroki Sato +1 more 2024-07-09
11864325 Method for forming metal pattern Kenjiro Koshiji, Noriaki Nakamura, Masato Kasuga, Yuusuke Ohshima, Hiroki Sato +2 more 2024-01-02
11149161 Metal ink Yuusuke Ohshima, Teruhisa IWAI, Hitoshi Kubo, Shigeki Yamanaka, Masahiro Ito +1 more 2021-10-19
10940534 Metal paste having excellent low-temperature sinterability and method for producing the metal paste Teruhisa IWAI, Hidekazu Matsuda, Hitoshi Kubo 2021-03-09
10892065 Method for forming metal pattern, and electric conductor Satoshi Miyazaki, Hitoshi Kubo, Tatsuo Hasegawa, Toshikazu Yamada 2021-01-12
10486235 Method for producing silver particles, and silver particles produced by the method Yuusuke Ohshima, Hidekazu Matsuda, Junichi Taniuchi, Noriaki Nakamura, Hitoshi Kubo 2019-11-26
9901985 Method for manufacturing silver particles Yuusuke Ohshima, Hidekazu Matsuda, Noriaki Nakamura, Junichi Taniuchi, Hitoshi Kubo 2018-02-27
9674953 Fine silver particle ink, fine silver particle sintered body, and method for producing fine silver particle ink Hitoshi Kubo, Yusuke Ohshima, Noriaki Nakamura, Hiroshi Noguchi, Junichi Taniuchi 2017-06-06
9607922 Semiconductor device and heat-dissipating mechanism Kenji Matsuda, Dai Shinozaki, Hitoshi Kubo, Yusuke Ohshima, Hidekazu Matsuda +1 more 2017-03-28