Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11724341 | Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device | Takeshi Nakano, Masaya Arai, Takanori SHIMAZAKI, Tsukasa KATSUYAMA | 2023-08-15 |
| 10926360 | Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device | Masaya Arai, Takeshi Nakano, Atsushi Hori, Tsukasa KATSUYAMA, Daisuke Maruyama | 2021-02-23 |
| 10456872 | Lead-free solder alloy, electronic circuit substrate, and electronic device | Masaya Arai, Takeshi Nakano, Atsushi Hori, Tsukasa KATSUYAMA | 2019-10-29 |