HH

Hongjun Hei

TT Taiyuan University Of Technology: 1 patents #156 of 480Top 35%
Overall (All Time): #2,607,501 of 4,157,543Top 65%
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Patent #TitleCo-InventorsDate
11761063 Method for preparing high-entropy alloy composites reinforced by diamond particles Yongsheng Wang, Shengwang Yu, Changxing Han, Naixu Wang, Bing Zhou +3 more 2023-09-19