MM

Masashi Miyazaki

TC Taiyo Yuden Co.: 32 patents #17 of 959Top 2%
HI Hitachi: 7 patents #5,859 of 28,497Top 25%
AD Advantest: 5 patents #198 of 1,193Top 20%
SO Sony: 4 patents #8,966 of 25,231Top 40%
HC Hitachi Chemical Company: 4 patents #392 of 1,946Top 25%
OM Omron: 4 patents #761 of 3,089Top 25%
AC Aisin Aw Co.: 3 patents #581 of 2,011Top 30%
IBM: 2 patents #32,839 of 70,183Top 50%
SC Seiko Electronic Components: 1 patents #18 of 47Top 40%
AN Alaxala Networks: 1 patents #73 of 140Top 55%
Brother Kogyo: 1 patents #2,155 of 2,767Top 80%
Overall (All Time): #39,075 of 4,157,543Top 1%
60
Patents All Time

Issued Patents All Time

Showing 26–50 of 60 patents

Patent #TitleCo-InventorsDate
9363897 Substrate with built-in electronic component Yuichi Sugiyama, Tatsuro Sawatari, Yusuke Inoue 2016-06-07
9317199 Setting a display position of a pointer Tomoka Mochizuki, Tomohiro Shimizu, Tomonori Sugiura 2016-04-19
9301407 Method of manufacturing substrate having cavity Yuichi Sugiyama, Tatsuro Sawatari, Hideki Yokota, Yutaka Hata 2016-03-29
9253386 Camera module Yuichi Sugiyama, Tatsuro Sawatari, Hideki Yokota, Yutaka Hata 2016-02-02
9078370 Substrate with built-in electronic component Yuichi Sugiyama, Tatsuro Sawatari, Yusuke Inoue, Yoshiki Hamada, Toshiyuki Kagawa 2015-07-07
8988885 Electronic circuit module and method for producing the same Tatsuro Sawatari, Yoshiki Hamada, Yuichi Sugiyama, Kazuaki IDA 2015-03-24
8963016 Printed wiring board and method for manufacturing same Hideki Yokota 2015-02-24
8959400 System, program, and method for collecting errors which occur while a user uses a computer Tomohiro Shimizu, Tomonori Sugiura 2015-02-17
RE45146 Composite multi-layer substrate and module using the substrate Mitsuhiro Takayama, Tatsuro Sawatari 2014-09-23
8811021 Electronic circuit module Yuichi Sugiyama, Tatsuro Sawatari 2014-08-19
8791783 Electronic component to be embedded in substrate and component-embedded substrate Yuichi Sugiyama, Yoshiki Hamada, Yutaka Hata, Hideki Yokota 2014-07-29
8774205 Network device and its control method and computer program product Hideo Kodaka, Shinji Nozaki 2014-07-08
8320447 Encoding apparatus and encoding method, and decoding apparatus and decoding method 2012-11-27
8314343 Multi-layer board incorporating electronic component and method for producing the same Yusuke Inoue, Eiji Mugiya, Tatsuro Sawatari, Yuichi Sugiyama 2012-11-20
8189674 Decoding method, program for decoding method, recording medium with recorded program for decoding method, and decoding device Daijou Shigemoto 2012-05-29
8119451 Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package 2012-02-21
8060326 Measuring apparatus, measuring method and test apparatus Hiroshi Ito 2011-11-15
7999577 Apparatus and method for detecting a changing point of measured signal 2011-08-16
7928560 Composite multi-layer substrate and module using the substrate Mitsuhiro Takayama, Tatsuro Sawatari 2011-04-19
7745926 Composite multi-layer substrate and module using the substrate Mitsuhiro Takayama, Tatsuro Sawatari 2010-06-29
7738256 Multilayer substrate including components therein Tatsuro Sawatari 2010-06-15
7379306 Multilayer substrate including components therein Tatsuro Sawatari 2008-05-27
7348662 Composite multi-layer substrate and module using the substrate Mitsuhiro Takayama, Tatsuro Sawatari 2008-03-25
7278205 Multilayer printed wiring board and production method therefor Mitsuhiro Takayama, Tatsuro Sawatari, Takatoshi Murota 2007-10-09
7275197 Testing apparatus Kenji Inaba 2007-09-25